BMC_Memory

Capacity

The total capacity of the memory device (in bytes).

The implementation form factor for the chip. The following options are provided:

• Unknown
• Other
• SIP
• DIP
• ZIP
• SOJ
• Proprietary
• SIMM
• DIMM
• TSOP
• PGA
• RIMM
• SODIMM
• SRIMM
• SMD
• SSMP
• QFP
• TQFP
• SOIC
• LCC
• PLCC
• BGA
• FPBGA
• LGA

Specifies whether you can remove a component while the containing machine is operating. A component is hot-swappable if you can replace it with a physically different but equivalent component while the containing machine is on. For example, a fan. All hot-swappable components are inherently removable and replaceable.

The following options are provided:

• None
• Yes
• No

The type of memory. The following options are provided:

• Unknown
• Other
• DRAM
• Synchronous DRAM
• Cache DRAM
• EDO
• EDRAM
• VRAM
• SRAM
• RAM
• ROM
• Flash
• EEPROM
• FEPROM
• EPROM
• CDRAM
• 3DRAM
• SDRAM
• SGRAM
• RDRAM
• DDR

Specifies whether you can remove the component from its containing machine without impairing the function of the overall package. A component is considered removable even if power must be switched off to perform the removal. If power can be on when the component is removed, the component is both removable and hot-swappable. For example, an upgradeable processor chip is removable.

The following options are provided:

• None
• Yes
• No

Specifies whether you can replace the component with a physically different component. For example, in some computer systems, you can replace the main processor chip with one of a higher clock rating. In this case, the processor is replaceable. All removable components are inherently replaceable.

The following options are provided:

• None
• Yes
• No

Asset #, CI Status, Class ID, Class Name, Description, Instance Name, Location, Mark As Deleted, Model Manufacturer, Model Name, Notes, Primary Client, Priority, Serial #, Short Description, Site, Stage, Supported, Supported By, Token Id, Version Number, Warranty Exp Date